256/512MB STICKS RAM LISTING:
A-Data
PC2700 (cl2,5) --chip--> could be Winbond AH-6 or BH-6
PC3200 --chip--> Winbond CH-5, Samsung TCCC
PC3200 --chip--> Special Edition Winbond BH-5
PC3700 (non Vitesta, no HS) --chip--> should Samsung TCC5
PC4000 (3-4-4-8) --chip--> Hynix D43, D5, Samsung TCCC
PC4000 Vitesta DDR500 (3-4-4-8) --chip--> Hynix D43, D5 or Samsung TCCD (few)
PC4500 Vitesta DDR566 --chip--> Samsung TCCD - Modified JEDEC PCB or Hynix B (few)
PC4800 Vitesta DDR600 --chip--> Samsung TCCD - Modified JEDEC PCB or Hynix B
Apacer
PC2700 --chip--> could be Winbond AH-6
PC4000 --chip--> Samsung TCCD
Buffalo
PC3200 --chip--> may or may not contain Micron 46V32M8 -5B C, 46V32M8 - 5B G look at the chips
PC3700 --chip--> may or may not contain Winbond BH-5, CH-5, Micron 46V32M8 -5B C look at the chips
FireStix PC4000 --chip--> Hynix B
FireStix PC3200 CL2 (2-2-2-4) --chip--> Samsung TCCD ~ Brainpower PCB
Centon
Advanced DDR --chip--> Samsung TCCD
New Advanced DDR533 (3-4-4-8) --chip--> Hynix D5
New Advanced DDR400 (2-2-2-5) --chip--> Samsung TCCD ~ Brainpower PCB
Corsair
XMS-PC2700C2 Rev1.1 (2-3-3-6-1T) --chip--> maybe Winbond BH-6/Samsung TCB3
XMS-PC2700C2 Rev1.2 (2-3-3-6-1T) --chip--> Winbond CH-6
XMS-PC2700C2 Rev1.3 (2-3-3-6-1T) --chip--> Mosel Vitelic (6ns?)
XMS-PC2700C2 Rev2.1 (2-3-3-6-1T) --chip--> Micron (6ns rev B)/Samsung TCB3
XMS-PC2700LL Rev1.1 (2-2-2-6-1T) --chip--> Winbond BH-6
XMS-PC2700LL Rev1.2 (2-2-2-6-1T) --chip--> Winbond CH-6
XMS-PC3000C2 Rev1.1 (2-3-3-6-1T) --chip--> Samsung TCB3/Micron (6ns rev B) and few Winbond BH-6
XMS-PC3000C2 Rev2.1 (2-3-3-6-1T) --chip--> should Winbond BH-6
XMS-PC3200C2 Rev1.0 (2-3-3-6-1T) --chip--> Winbond CH-5
XMS-PC3200C2 Rev1.1/2.1 (2-3-3-6-1T) --chip--> Winbond BH-6
XMS-PC3200C2 Rev1.2/2.2 (2-3-3-6-1T) --chip--> Winbond CH-6
XMS-PC3200C2 Rev1.3 (2-2-2-5-1T) --chip--> Winbond UTT ?
XMS-PC3200C2 Rev1.4 (2-2-2-5-1T) --chip--> Mosel Vitelic 5ns ~ Brainpower PCB
XMS-PC3200C2 Rev1.5 (2-2-2-5-1T) --chip--> Winbond New BH-5 ~ Brainpower PCB
XMS-PC3200C2 Rev1.6 (2-2-2-5-1T) --chip--> Winbond UTT ~ Brainpower PCB
XMS-PC3200C2 Rev1.7 (2-2-2-5-1T) --chip--> Winbond New BH-5\UTT ~ Brainpower PCB ?
XMS-PC3200C2 Rev3.1 (2-3-3-6-1T) --chip--> Infineon B-5
XMS-PC3200C2 Rev4.1 (2-3-3-6-1T) --chip--> Samsung TCCD
XMS-PC3200C2 Rev4.2 (2-3-3-6-1T) --chip--> Samsung TCCD & TCC5
XMS-PC3200C2 Rev4.3 (2-3-3-6-1T) --chip--> Samsung TCCD & TCC5 (Rev. F) ~ Brainpower PCB
XMS-PC3200C2 Rev5.1/6.1 (2-3-3-6-1T) --chip--> Mosel Vitelic 5ns
XMS-PC3200LL Rev1.1/2.1 (2-2-2-6-1T) --chip--> Winbond BH-5
XMS-PC3200LL Rev1.2/2.2 (2-3-2-6-1T) --chip--> Winbond CH-5
XMS-PC3200LL Rev3.1 (2-3-2-6-1T) --chip--> Infineon B-5
XMS-PC3200XL/XLPT Rev1.1 (2-2-2-5-1T) --chip--> Samsung TCCD
XMS-PC3200XL/XLPT Rev1.2 (2-2-2-5-1T) --chip--> Samsung TCCD ~ Brainpower PCB
XMS-PC3500C2 Rev1.1 (2-3-3-7-1T) --chip--> Winbond BH-5
XMS-PC3700 Rev1.1(3-4-4-8-1T) --chip--> Samsung TCCC
XMS-PC4000 Rev1.1 (3-4-4-8-1T) --chip--> Hynix D43
XMS-PC4000 Rev3.1 (3-4-4-8) --chip--> Samsung TCCC
XMS-PC4400 Rev1.1 (3-4-4-8-1T) --chip--> Hynix D5
XMS-PC4400C25 (2.5-4-4-8-1T) --chip--> Samsung TCCD ~ Brainpower PCB
Crucial
PC3200 --chip--> may or may not contain Micron 46V32M8 -5B C, 46V32M8 -5B G
Ballistix PC3200 (2-2-2-8) --chip--> Micron 46V32M8 -5B G (maybe overlabeled)
Ballistix PC4000 (2.5-4-4-8) --chip--> Micron 46V32M8 -5B G (maybe overlabeled)
GeIL
GeIL ONE TCCD (S) PC3200 (1,5-2-2-5-1T) PC4800 (2,5-4-4-7-1T) @2.55V-2.95V --chip--> hand-picked TCCD ~ Brainpower PCB
GeIL ONE BH (W) PC3200 (1,5-2-2-5-1T) PC4000 (2-2-2-5-1T) @2.55V-3.80V --chip--> New BH5 ~ Brainpower PCB
Value PC3200 Blue (2.5-3-3-6) --chip--> Infineon 5ns, Hynix D5, D43, Winbond BH5\UTT (new ones)
Golden Dragon PC3200 (2-3-3-6-1T) --chip--> WLCSP chip package w/ Samsung chips
Ultra Platinum PC3200 (2-3-3-6-1T) --chip--> Winbond CH-5, Mosel Vitelic 5ns
Ultra-X PC3200 (2-2-2-5) --chip--> Samsung TCCD (old ones), Wibond BH-5\UTT (hand-picked, relabeled) ~ Brainpower PCB
Ultra-X PC4000\PC4400 (2-2-2-5\2,5-3-3-5\2,5-4-4-7 -1T) --chip--> Samsung TCCD (hand-picked, relabeled) ~ Brainpower PCB
Golden Dragon PC3500 (2.5-3-3-6-1T) --chip--> WLCSP chip package w/ Samsung chips
Ultra Platinum PC3500 (2.5-3-3-6-1T) --chip--> Winbond CH-5, Mosel Vitelic 5ns, Winbond BH5\UTT (new ones)
Golden Dragon PC3700 (2.5-4-4-7-1T) --chip--> WLCSP chip package w/ Samsung chips
Golden Dragon PC4000 (2.5-4-4-7-1T) --chip--> WLCSP chip package w/ Samsung chips
Ultra Series PC3200 (2-3-3-6-1T) --chip--> Samsung TCC5
Ultra Platinum PC4000 (3-4-4-8-1T) --chip--> Hynix D43
Ultra Platinum PC4200 (3-4-4-8-1T) --chip--> Hynix D43
Ultra Platinum PC4400 (3-4-4-8-1T) --chip--> Hynix D5
G.Skill
G.SKILL PC3200(DDR400 1T) (2-3-3-6 1T @2,6V-2,75V), (F1-3200PHU2-512MBZX/1GBZX) --chip--> Micron 46V32M8 -5B G (?), Mosel Vitelic 5ns (?) (overlabeled) ~ Brainpower PCB
G.SKILL PC3200(DDR400 1T) (2-2-2-5 1T), (F1-3200BWU2-512MBGH/1GBGH) --chip--> Winbond UTT ~ Brainpower PCB
G.SKILL PC4400(DDR550) (2.5-4-4-8), PC3200 (2-2-2-5) 1GB Kit (F1-3200DSU2-512LC/1GBLC) --chip--> Samsung TCCD ~ Brainpower PCB
G.SKILL PC4400(DDR550) (2.5-3-3-7), PC3200 (2-2-2-5) 512M Kit (F1-3200DSU2-512LE/1GBLE) --chip--> Samsung TCCD (new production) ~ Brainpower PCB
G.SKILL PC4400(DDR550) (2.5-4-4-8), PC3200 (2-3-3-6) (F1-3200DSU2-512LD/1GBLD) --chip--> Samsung TCCD ~ Brainpower PCB
G.SKILL PC4400(DDR550) (2.5-4-4-8) (F1-3200DSU2-512FC/1GBFC) --chip--> Samsung TCCD, Samsung TCC5 ~ Brainpower PCB
G.SKILL PC4800(DDR600 2T) (2.5-4-4-8 2T) (F1-3200DSU2-512FR/1GBFR) --chip--> Samsung TCCD (new production) ~ Brainpower PCB
G.SKILL PC4800(DDR600 1T) (2.5-4-4-8 1T), PC3200 (2-2-2-5), (F1-3200DSU2-512FF/1GBFF) --chip--> hand-picked Samsung TCCD (new production) ~ Brainpower PCB
G.SKILL PC4800(DDR600) (2.5-4-4-8 2T | 3-4-4-8 1T), PC3200 (2-2-2-5) (F1-3200DSU2-512LA/1GBLA) --chip--> Samsung TCCD (new production) ~ Brainpower PCB
Kingmax (incomplete)
Hardcore PC4000 DDR500 TSOP (3-4-4-8-1T) --chip--> Hynix D5 ~ Brainpower PCB
Hardcore PC4000 DDR500 BGA (3-4-4-8-1T) --chip--> Hynix B ~ Brainpower PCB
Kingston
HyperX PC2700 (2-2-2-5-1T) (KHX 2700) --chip--> first Samsung TCB3, then Winbond BH-6, CH-6, CH-5, relabeled unknown Chips.
HyperX PC3000 (2-2-2-6-1T) (KHX 3000) --chip--> first Samsung TCB3, then mainly Winbond BH-5, some BH-6, CH-5, CH-6 (maybe relabeled)
HyperX PC 3200 (old revision, not AK2, K2 or A) (KHX 3200) --chip--> Winbond BH-5
HyperX PC 3200K2 (2-2-2-6-1T) (KHX 3200K2) --chip--> Winbond BH-5
HyperX PC 3200AK2 (2-3-2-6-1T) (KHX 3200AK2) --chip--> Winbond CH-5
HyperX PC 3200ULK2 (2-2-2-5-1T) (KHX 3200ULK2) --chip--> Samsung TCCD
HyperX PC 3500 (rated 2-3-3-7 @ 433Mhz, 2-2-2-6 @ 400Mhz, old revision) (KHX 3500) --chip--> Winbond BH-5 (maybe relabeled)
HyperX PC 3500K2 (2-3-3-7) (KHX 3500K2) --chip--> Winbond CH-5
HyperX PC 3500A (2-3-3-7) (KHX 3500A) --chip--> Winbond CH-5
HyperX PC 4000K2 (3-4-4-8) (KHX 4000K2) --chip--> Samsung TCCC, Hynix D43, D5
HyperX PC 4300K2 (3-4-4-8) (KHX 4300K2) --chip--> Hynix D5
Kingston Ram w/remarked Chips as D328DW-45 --chip--> Before Week 18 Year 03 Winbond BH-5, after CH-5 (18 03 can be both)
Kingston Ram w/remarked Chips as D328DW-5 --chip--> Winbond BH-5
Kingston Ram w/remarked Chips as D328DW-6 Winbond BH-6
Kingston Ram w/remarked Chips as D328DM-6 --chip--> should Winbond BH-6
Kingston Ram w/remarked Chips as D328DM-5 --chip--> should Winbond BH-5
Value Ram 333Mhz (2,5-3-3-*) (KVR333X64C25) --chip--> may or may not contain Winbond BH-6, AH-6, Hynix D43, D5 look at the chips (maybe relabeled)
Value Ram 400Mhz (2,5-3-3-*) (KVR400X64C25) --chip--> may or may not contain Winbond BH-5, CH-5, Micron 46V32M8 -5B C, Hynix D43, D5, Samsung TCCC, TCC4 look at the chips (maybe relabeled)
Mushkin
PC2700 (Non Level X, rated 2-3-3, Promo-Build) --chip--> Winbond CH-6
PC3200 Cl2,5 (Non Level X, non Blue, non Green Serie) --chip--> Winbond BH-5, Samsung TCB3
PC3200 (Non Level X, rated 2-2-2, Promo-Build) --chip--> Winbond BH-5
PC3200 Level I (2-3-2) --chip--> Winbond CH-5
PC3200 Level II (2-2-2) --chip--> Winbond BH-5 or BH-6
PC3200 Special 2-2-2 --chip--> Winbond BH-6
PC3200 Level II V2 (2-2-2) --chip--> Samsung TCCD
PC3500 Level I (2-3-3) --chip--> Winbond CH-5
PC3500 Level II (2-2-2) --chip--> Winbond BH-5
PC3200 BLUE CL2 (2-3-3-X) --chip--> Winbond UTT ~ Brainpower PCB
PC3700 (2,5-4-3) --chip--> Samsung TCCD (rev. F)
PC3200/3500/4000 REDLINE XP3200/3500/4000 DDR400/433/500 (2-2-2-5-1T @+3V) --chip--> Winbond UTT ~ Brainpower PCB
PC3200 Dual Pack (2-2-2) --chip--> Samsung TCCD\TCC5 (rev. F) ~ Brainpower PCB
PC4400 Dual Pack (2,5-4-4) --chip--> Samsung TCCD (rev. F) ~ Brainpower PCB
PC2700 = DDR333
PC3200 = DDR400
PC3500 = DDR433
PC3700 = DDR466
PC4000 = DDR500
PC4200 = DDR533
PC4400 = DDR550
PC4800 = DDR600
A-Data
PC2700 (cl2,5) --chip--> could be Winbond AH-6 or BH-6
PC3200 --chip--> Winbond CH-5, Samsung TCCC
PC3200 --chip--> Special Edition Winbond BH-5
PC3700 (non Vitesta, no HS) --chip--> should Samsung TCC5
PC4000 (3-4-4-8) --chip--> Hynix D43, D5, Samsung TCCC
PC4000 Vitesta DDR500 (3-4-4-8) --chip--> Hynix D43, D5 or Samsung TCCD (few)
PC4500 Vitesta DDR566 --chip--> Samsung TCCD - Modified JEDEC PCB or Hynix B (few)
PC4800 Vitesta DDR600 --chip--> Samsung TCCD - Modified JEDEC PCB or Hynix B
Apacer
PC2700 --chip--> could be Winbond AH-6
PC4000 --chip--> Samsung TCCD
Buffalo
PC3200 --chip--> may or may not contain Micron 46V32M8 -5B C, 46V32M8 - 5B G look at the chips
PC3700 --chip--> may or may not contain Winbond BH-5, CH-5, Micron 46V32M8 -5B C look at the chips
FireStix PC4000 --chip--> Hynix B
FireStix PC3200 CL2 (2-2-2-4) --chip--> Samsung TCCD ~ Brainpower PCB
Centon
Advanced DDR --chip--> Samsung TCCD
New Advanced DDR533 (3-4-4-8) --chip--> Hynix D5
New Advanced DDR400 (2-2-2-5) --chip--> Samsung TCCD ~ Brainpower PCB
Corsair
XMS-PC2700C2 Rev1.1 (2-3-3-6-1T) --chip--> maybe Winbond BH-6/Samsung TCB3
XMS-PC2700C2 Rev1.2 (2-3-3-6-1T) --chip--> Winbond CH-6
XMS-PC2700C2 Rev1.3 (2-3-3-6-1T) --chip--> Mosel Vitelic (6ns?)
XMS-PC2700C2 Rev2.1 (2-3-3-6-1T) --chip--> Micron (6ns rev B)/Samsung TCB3
XMS-PC2700LL Rev1.1 (2-2-2-6-1T) --chip--> Winbond BH-6
XMS-PC2700LL Rev1.2 (2-2-2-6-1T) --chip--> Winbond CH-6
XMS-PC3000C2 Rev1.1 (2-3-3-6-1T) --chip--> Samsung TCB3/Micron (6ns rev B) and few Winbond BH-6
XMS-PC3000C2 Rev2.1 (2-3-3-6-1T) --chip--> should Winbond BH-6
XMS-PC3200C2 Rev1.0 (2-3-3-6-1T) --chip--> Winbond CH-5
XMS-PC3200C2 Rev1.1/2.1 (2-3-3-6-1T) --chip--> Winbond BH-6
XMS-PC3200C2 Rev1.2/2.2 (2-3-3-6-1T) --chip--> Winbond CH-6
XMS-PC3200C2 Rev1.3 (2-2-2-5-1T) --chip--> Winbond UTT ?
XMS-PC3200C2 Rev1.4 (2-2-2-5-1T) --chip--> Mosel Vitelic 5ns ~ Brainpower PCB
XMS-PC3200C2 Rev1.5 (2-2-2-5-1T) --chip--> Winbond New BH-5 ~ Brainpower PCB
XMS-PC3200C2 Rev1.6 (2-2-2-5-1T) --chip--> Winbond UTT ~ Brainpower PCB
XMS-PC3200C2 Rev1.7 (2-2-2-5-1T) --chip--> Winbond New BH-5\UTT ~ Brainpower PCB ?
XMS-PC3200C2 Rev3.1 (2-3-3-6-1T) --chip--> Infineon B-5
XMS-PC3200C2 Rev4.1 (2-3-3-6-1T) --chip--> Samsung TCCD
XMS-PC3200C2 Rev4.2 (2-3-3-6-1T) --chip--> Samsung TCCD & TCC5
XMS-PC3200C2 Rev4.3 (2-3-3-6-1T) --chip--> Samsung TCCD & TCC5 (Rev. F) ~ Brainpower PCB
XMS-PC3200C2 Rev5.1/6.1 (2-3-3-6-1T) --chip--> Mosel Vitelic 5ns
XMS-PC3200LL Rev1.1/2.1 (2-2-2-6-1T) --chip--> Winbond BH-5
XMS-PC3200LL Rev1.2/2.2 (2-3-2-6-1T) --chip--> Winbond CH-5
XMS-PC3200LL Rev3.1 (2-3-2-6-1T) --chip--> Infineon B-5
XMS-PC3200XL/XLPT Rev1.1 (2-2-2-5-1T) --chip--> Samsung TCCD
XMS-PC3200XL/XLPT Rev1.2 (2-2-2-5-1T) --chip--> Samsung TCCD ~ Brainpower PCB
XMS-PC3500C2 Rev1.1 (2-3-3-7-1T) --chip--> Winbond BH-5
XMS-PC3700 Rev1.1(3-4-4-8-1T) --chip--> Samsung TCCC
XMS-PC4000 Rev1.1 (3-4-4-8-1T) --chip--> Hynix D43
XMS-PC4000 Rev3.1 (3-4-4-8) --chip--> Samsung TCCC
XMS-PC4400 Rev1.1 (3-4-4-8-1T) --chip--> Hynix D5
XMS-PC4400C25 (2.5-4-4-8-1T) --chip--> Samsung TCCD ~ Brainpower PCB
Crucial
PC3200 --chip--> may or may not contain Micron 46V32M8 -5B C, 46V32M8 -5B G
Ballistix PC3200 (2-2-2-8) --chip--> Micron 46V32M8 -5B G (maybe overlabeled)
Ballistix PC4000 (2.5-4-4-8) --chip--> Micron 46V32M8 -5B G (maybe overlabeled)
GeIL
GeIL ONE TCCD (S) PC3200 (1,5-2-2-5-1T) PC4800 (2,5-4-4-7-1T) @2.55V-2.95V --chip--> hand-picked TCCD ~ Brainpower PCB
GeIL ONE BH (W) PC3200 (1,5-2-2-5-1T) PC4000 (2-2-2-5-1T) @2.55V-3.80V --chip--> New BH5 ~ Brainpower PCB
Value PC3200 Blue (2.5-3-3-6) --chip--> Infineon 5ns, Hynix D5, D43, Winbond BH5\UTT (new ones)
Golden Dragon PC3200 (2-3-3-6-1T) --chip--> WLCSP chip package w/ Samsung chips
Ultra Platinum PC3200 (2-3-3-6-1T) --chip--> Winbond CH-5, Mosel Vitelic 5ns
Ultra-X PC3200 (2-2-2-5) --chip--> Samsung TCCD (old ones), Wibond BH-5\UTT (hand-picked, relabeled) ~ Brainpower PCB
Ultra-X PC4000\PC4400 (2-2-2-5\2,5-3-3-5\2,5-4-4-7 -1T) --chip--> Samsung TCCD (hand-picked, relabeled) ~ Brainpower PCB
Golden Dragon PC3500 (2.5-3-3-6-1T) --chip--> WLCSP chip package w/ Samsung chips
Ultra Platinum PC3500 (2.5-3-3-6-1T) --chip--> Winbond CH-5, Mosel Vitelic 5ns, Winbond BH5\UTT (new ones)
Golden Dragon PC3700 (2.5-4-4-7-1T) --chip--> WLCSP chip package w/ Samsung chips
Golden Dragon PC4000 (2.5-4-4-7-1T) --chip--> WLCSP chip package w/ Samsung chips
Ultra Series PC3200 (2-3-3-6-1T) --chip--> Samsung TCC5
Ultra Platinum PC4000 (3-4-4-8-1T) --chip--> Hynix D43
Ultra Platinum PC4200 (3-4-4-8-1T) --chip--> Hynix D43
Ultra Platinum PC4400 (3-4-4-8-1T) --chip--> Hynix D5
G.Skill
G.SKILL PC3200(DDR400 1T) (2-3-3-6 1T @2,6V-2,75V), (F1-3200PHU2-512MBZX/1GBZX) --chip--> Micron 46V32M8 -5B G (?), Mosel Vitelic 5ns (?) (overlabeled) ~ Brainpower PCB
G.SKILL PC3200(DDR400 1T) (2-2-2-5 1T), (F1-3200BWU2-512MBGH/1GBGH) --chip--> Winbond UTT ~ Brainpower PCB
G.SKILL PC4400(DDR550) (2.5-4-4-8), PC3200 (2-2-2-5) 1GB Kit (F1-3200DSU2-512LC/1GBLC) --chip--> Samsung TCCD ~ Brainpower PCB
G.SKILL PC4400(DDR550) (2.5-3-3-7), PC3200 (2-2-2-5) 512M Kit (F1-3200DSU2-512LE/1GBLE) --chip--> Samsung TCCD (new production) ~ Brainpower PCB
G.SKILL PC4400(DDR550) (2.5-4-4-8), PC3200 (2-3-3-6) (F1-3200DSU2-512LD/1GBLD) --chip--> Samsung TCCD ~ Brainpower PCB
G.SKILL PC4400(DDR550) (2.5-4-4-8) (F1-3200DSU2-512FC/1GBFC) --chip--> Samsung TCCD, Samsung TCC5 ~ Brainpower PCB
G.SKILL PC4800(DDR600 2T) (2.5-4-4-8 2T) (F1-3200DSU2-512FR/1GBFR) --chip--> Samsung TCCD (new production) ~ Brainpower PCB
G.SKILL PC4800(DDR600 1T) (2.5-4-4-8 1T), PC3200 (2-2-2-5), (F1-3200DSU2-512FF/1GBFF) --chip--> hand-picked Samsung TCCD (new production) ~ Brainpower PCB
G.SKILL PC4800(DDR600) (2.5-4-4-8 2T | 3-4-4-8 1T), PC3200 (2-2-2-5) (F1-3200DSU2-512LA/1GBLA) --chip--> Samsung TCCD (new production) ~ Brainpower PCB
Kingmax (incomplete)
Hardcore PC4000 DDR500 TSOP (3-4-4-8-1T) --chip--> Hynix D5 ~ Brainpower PCB
Hardcore PC4000 DDR500 BGA (3-4-4-8-1T) --chip--> Hynix B ~ Brainpower PCB
Kingston
HyperX PC2700 (2-2-2-5-1T) (KHX 2700) --chip--> first Samsung TCB3, then Winbond BH-6, CH-6, CH-5, relabeled unknown Chips.
HyperX PC3000 (2-2-2-6-1T) (KHX 3000) --chip--> first Samsung TCB3, then mainly Winbond BH-5, some BH-6, CH-5, CH-6 (maybe relabeled)
HyperX PC 3200 (old revision, not AK2, K2 or A) (KHX 3200) --chip--> Winbond BH-5
HyperX PC 3200K2 (2-2-2-6-1T) (KHX 3200K2) --chip--> Winbond BH-5
HyperX PC 3200AK2 (2-3-2-6-1T) (KHX 3200AK2) --chip--> Winbond CH-5
HyperX PC 3200ULK2 (2-2-2-5-1T) (KHX 3200ULK2) --chip--> Samsung TCCD
HyperX PC 3500 (rated 2-3-3-7 @ 433Mhz, 2-2-2-6 @ 400Mhz, old revision) (KHX 3500) --chip--> Winbond BH-5 (maybe relabeled)
HyperX PC 3500K2 (2-3-3-7) (KHX 3500K2) --chip--> Winbond CH-5
HyperX PC 3500A (2-3-3-7) (KHX 3500A) --chip--> Winbond CH-5
HyperX PC 4000K2 (3-4-4-8) (KHX 4000K2) --chip--> Samsung TCCC, Hynix D43, D5
HyperX PC 4300K2 (3-4-4-8) (KHX 4300K2) --chip--> Hynix D5
Kingston Ram w/remarked Chips as D328DW-45 --chip--> Before Week 18 Year 03 Winbond BH-5, after CH-5 (18 03 can be both)
Kingston Ram w/remarked Chips as D328DW-5 --chip--> Winbond BH-5
Kingston Ram w/remarked Chips as D328DW-6 Winbond BH-6
Kingston Ram w/remarked Chips as D328DM-6 --chip--> should Winbond BH-6
Kingston Ram w/remarked Chips as D328DM-5 --chip--> should Winbond BH-5
Value Ram 333Mhz (2,5-3-3-*) (KVR333X64C25) --chip--> may or may not contain Winbond BH-6, AH-6, Hynix D43, D5 look at the chips (maybe relabeled)
Value Ram 400Mhz (2,5-3-3-*) (KVR400X64C25) --chip--> may or may not contain Winbond BH-5, CH-5, Micron 46V32M8 -5B C, Hynix D43, D5, Samsung TCCC, TCC4 look at the chips (maybe relabeled)
Mushkin
PC2700 (Non Level X, rated 2-3-3, Promo-Build) --chip--> Winbond CH-6
PC3200 Cl2,5 (Non Level X, non Blue, non Green Serie) --chip--> Winbond BH-5, Samsung TCB3
PC3200 (Non Level X, rated 2-2-2, Promo-Build) --chip--> Winbond BH-5
PC3200 Level I (2-3-2) --chip--> Winbond CH-5
PC3200 Level II (2-2-2) --chip--> Winbond BH-5 or BH-6
PC3200 Special 2-2-2 --chip--> Winbond BH-6
PC3200 Level II V2 (2-2-2) --chip--> Samsung TCCD
PC3500 Level I (2-3-3) --chip--> Winbond CH-5
PC3500 Level II (2-2-2) --chip--> Winbond BH-5
PC3200 BLUE CL2 (2-3-3-X) --chip--> Winbond UTT ~ Brainpower PCB
PC3700 (2,5-4-3) --chip--> Samsung TCCD (rev. F)
PC3200/3500/4000 REDLINE XP3200/3500/4000 DDR400/433/500 (2-2-2-5-1T @+3V) --chip--> Winbond UTT ~ Brainpower PCB
PC3200 Dual Pack (2-2-2) --chip--> Samsung TCCD\TCC5 (rev. F) ~ Brainpower PCB
PC4400 Dual Pack (2,5-4-4) --chip--> Samsung TCCD (rev. F) ~ Brainpower PCB
PC2700 = DDR333
PC3200 = DDR400
PC3500 = DDR433
PC3700 = DDR466
PC4000 = DDR500
PC4200 = DDR533
PC4400 = DDR550
PC4800 = DDR600